Wi-Fi & Bluetooth FGS061N
- Wi-Fi 6 and Bluetooth 5.2 module
- Max. data rate of 600.4 Mbps
- LGA form factor
- 14 mm × 13 mm × 2 mm
- 0.7 g
- Operating temperature range of -40°C to +85°C
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Key features
- Dual-band 2.4 GHz and 5 GHz Wi-Fi and Bluetooth 5.2
- SDIO 3.0 interface with higher data transmission rate and lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide temperature range: -40 °C to +85 °C
Overview
The FGS061N is a high-performance Wi-Fi 6, Bluetooth 5.2 module in LGA package launched by Quectel. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 11 rates in an 80 MHz bandwidth with 1024QAM supported. It is designed with a reliable SDIO 3.0 interface to provide WLAN capability.
With an ultra-compact size of 14.0 mm × 13.0 mm × 2.0 mm, FGS061N optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications. Surface-mount Technology (SMT) makes FGS061N an ideal solution for durable and rugged designs. Its low profile and small size of LGA package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications.
The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, FGS061N is suitable for a variety of smart home and industrial applications.
Product Brochure
Quectel-Product-Brochure-V7.7.pdf
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