Wi-Fi & Bluetooth FCS866R
- Wi-Fi 6 and Bluetooth 5.2 module
- Max. data rate of 1201Mbps
- LCC form factor
- 15mm × 13mm × 2mm
- 0.79g
- Operating temperature range of -20°C to +70°C
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Key features
- Dual-band 2.4GHz and 5GHz Wi-Fi and Bluetooth 5.2
- SDIO 3.0 interface with higher data transmission rate and lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide temperature range: -20°C to +70°C
Overview
FCS866R is a high-performance Wi-Fi 6 and Bluetooth 5.2 module featuring 2T2R in an LCC package. It can be used for WLAN and Bluetooth connections, providing a maximum data rate of up to 1201Mbps. With an ultra-compact size of 15.0mm × 13.0mm × 2.0mm, the module optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs. The low profile and small size of the LCC package ensure that the module can be easily embedded into size-constrained applications to provide reliable connectivity.
Designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission. Coupled with its compact size, low power consumption, and high reliability, the FCS866R can meet application needs in a variety of fields.
Product Brochure
Quectel-Product-Brochure-V7.7.pdf
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