Wi-Fi & Bluetooth FCS850R
- Wi-Fi 5 and Bluetooth 5.0 module
- Max. data rate of 150Mbps
- LCC form factor
- 15.0mm × 13.0mm × 2.3mm
- 0.82g
- Operating temperature range of 0°C to +70°C
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Key features
- Supports 2.4GHz and 5GHz Wi-Fi and Bluetooth 5.0
- Supports SDIO 3.0 interface which features higher data transmission rate and lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: 0 °C to +70 °C
Overview
FCS850R is a series of high-performance Wi-Fi 5 and Bluetooth 5.0 modules featuring 2T2R in an LCC package. It can be used to establish WLAN and Bluetooth connections, providing a maximum data rate up to 866.7Mbps. With an ultra-compact size of 15mm × 13mm × 2.3mm, the module optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs. The low profileand small size of LCC package ensure that the module can be easily embedded into size-constrained applications to provide reliable connectivity. Designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission. This, coupled with its compact size and wide operating temperature range, the module can meet Wi-Fi & Bluetooth application design requirements in the consumer field.
Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here
Product Brochure
Quectel-Product-Brochure-V7.7.pdf
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