Wi-Fi & Bluetooth FCE863R
- Wi-Fi 6 and Bluetooth 5.2 module
- Max. data rate of 1201 Mbps
- LCC form factor
- 15 mm × 13 mm × 2.2 mm
- 0.93 g
- Operating temperature range of -20°C to +70°C
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Key features
- Dual-band 2.4 GHz and 5 GHz Wi-Fi and Bluetooth 5.2
- Supports PCIe 1.1 interface, with higher data transmission
rate and low power consumption - Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide temperature range: -20 °C to +70 °C
Overview
FCE863R is a high-performance Wi-Fi 6 and Bluetooth 5.2 module featuring 2T2R in LCC package. It can be used for WLAN and Bluetooth connections, providing a maximum data rate up to 1201Mbps. With an ultra-compact size of 15.0 mm × 13.0 mm × 2.2 mm, the module optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications.
Based on the reliable PCIe 1.1 interface, the module can achieve high-speed and low-power WLAN wireless transmission. Combining its compact size, lower power consumption, with an ultra wide temperature range and high reliability, the FCE863R can meet the application needs of the consumer field.
Product Brochure
Quectel-Product-Brochure-V7.7.pdf
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